SYNTHETIC RESINS FOR BONDING POLYSTIRENE FOAM
Adhesive formulated for bonding polystirene foam, and therefore suitable for those materials, which can be easily damaged by solvent. It can be used at service temperature range from -20°C to +60°C. Available also in S (spray) version.
More information on the features and use see Technical Data Sheet.
More information on the features and use see Technical Data Sheet.